ABSTRACT
Contact: m-kase@orc.co.fp 1. Introduction Super high-pressure mercury lamps (written by "lamps" hereafter) have been used as light sources for the exposure process of photolithography such as patterning PCB, LCD, and Semiconductors. It is estimated that their operating pressure is more than 1.0 MPa, and outer temperature of bulb is above 500°C. If once lamp is burst in their operations, fragments of the bulb sometime cause great damage in optical parts. The burst is considered from their sealed parts where metal and glass parts are joined together')'". Generally speaking, some factors have influenced the burst of lamps in operation. Among the factors, pressure loading is considered one of the most dominant factors. Therefore, the objectives of this study are to examine the burst of the sealed parts under internal pressure loadings.
