ABSTRACT
This chapter deals with an introduction and importance of microelectromechanical systems (MEMS) in wireless communications. It presents Radio frequency microelectromechanical systems (RF MEMS) and discusses various components including MEMS-based inductors, variable capacitors, tuning of capacitors, and RF switches. The chapter explores the problems of switches and reliability issue of RF MEMS. It also discusses the packaging technology of RF MEMS and describes wafer-level packaging. The chapter analyzes the methods of fabrication of RF MEMS. Wireless communications continues to grow with new applications in the consumer, medical, and military arena by employing radio frequency (RF) and microwave circuits and systems. The properties of MEMS, such as low power consumption, small size and volume, added functionality, and reconfigur-ability, are making wireless communications a ubiquitous connectivity. In wireless communications, research efforts are currently aimed at developing a single-chip RF circuit to increase functionality and meeting the demand of low power consumption, lower cost, and lower weight.
