ABSTRACT
Silicon (Si), the second most abundant element on earth, is one of the key componentsofcontemporaryadvancedmicroelectroniccircuits.Onthe otherhand,moderncomplementarymetaloxidesemiconductor(CMOS) technologyhasalsoenabledittobeanidealplatformforsomeoptoelectronicapplications,primarilypassivecomponents.Incomparablybetter purity and defect density plus much more mature fabrication over its compoundsemiconductor(CS)counterpartsallowSiwaveguidestodemonstrate
CONTENTS
7.1Introduction ................................................................................................ 281 7.2 Hybrid III-V-on-Si Platform ..................................................................... 282
7.2.1 Overview of New Hybrid Platforms ........................................... 282 7.2.2 Bonding Techniques ...................................................................... 287
7.2.2.1O2 Plasma-Assisted Direct Bonding ............................. 289 7.2.2.2SiO2-Based Covalent (Molecule) Bonding ................... 292 7.2.2.3Polymer-Based Adhesive Bonding ............................... 293
7.3Integrated Optoelectronic Devices .......................................................... 295 7.3.1Hybrid Si Light Emitters ............................................................... 295
7.3.1.1Hybrid Si Fabry-Perot Resonator Lasers ..................... 295 7.3.1.2 Hybrid Si Mode-Locked Lasers .................................... 296 7.3.1.3Hybrid Si DFB/DBR Lasers ........................................... 299 7.3.1.4Hybrid Si Micro-Disk/Ring Lasers .............................. 302
7.3.2Hybrid Si Modulators ....................................................................306 7.3.3Si Photodetectors ............................................................................309
