ABSTRACT
Metal/polymer interfaces are important for a variety of applications in the hightechnology areas of microelectronics and microsystems, as well as for other, more con ventional applications such as decorative overlayers, diffusion barriers, and electro magnetic shielding. Depending on the specific metal/polymer system, the interface may exhibit little or no adhesion unless the polymer is pretreated prior to metal deposition \ However, stringent demands may be placed on this pretreatment process, especially in the area of microsystem technology. For example, in a sensor module many different materials may be integrated which restrict the possible thermal processing steps and thus do not allow the application of all the conventional methods to enhance the metal/polymer adhesion.
