ABSTRACT
The superior properties of chemical-vapor-deposited (CVD) diamond films make them attractive in many potential applications [1-4]. In order to obtain reliable diamond films, residual stresses must be identified and controlled. Generally such stresses arise from two sources, namely, intrinsic stress and thermal stress. Struc tural mismatch between the film and substrate and the defects within the film are responsible for intrinsic stress, while thermal stress originates from the difference in the thermal expansion coefficients of the film and substrate.
