ABSTRACT
As a result of its unique electrical, mechanical and tribological properties, diamond has been the focus of great interest both as an object of scientific study and as an ideal material for applications, ranging from cutting tool coatings and waste water purifiers to chemical sensors, electronic devices and micro-and nanoelectromechanical systems (M/NEMS). Due to its high fracture strength and chemical robustness, it can withstand exposure to harsh environments and resist mechanical wear long after most other materials fail. Thus, diamond is a potential candidate for replacing silicon for M/NEMS applications [1-3]. Silicon has a relatively high surface energy, is very brittle, and tends to fracture easily. The native oxide on silicon produces a hydrophilic surface that encourages water to form bridges between micro-and nanoscale objects in close proximity, often causing device failure. Hence, silicon M/NEMS surfaces typically require special coatings (e.g., self-assembled monolayers) to protect these devices from the devastating effects of adhesion [4, 5]. With these issues in mind, the adhesion properties of diamond at the micro-and nanoscale must be investigated to determine whether diamond is superior to silicon.
