ABSTRACT
Anisotropic conductive film (ACF) adhesives are used in the assembly of electronic devices that generally require connections between flexible printed circuits or integrated circuit chips and various next-level interconnects such as printed circuit boards, flat panel displays, flexible printed circuits, or touch screens, to list a few common examples. These ACF materials typically require the use of hot bar bonding equipment that applies heat and pressure through the flexible printed circuit or integrated circuit chip to compress together the corresponding connecting pads
thus trapping conductive particles in the adhesive to create an electrical current path while simultaneously causing the adhesive thermosetting resin to undergo cure by holding for a sufficient time.
