ABSTRACT
Flip-chip technology is a significant development in surface mount technology (SMT) to improve cost, reliability and productivity in electronic packaging industry. In this technology, the semiconductor chip is turned upside down, i.e. active face down and hence called flip-chip, and bonded directly to a printed circuit board (PCB) or chip carrier substrate, in which all I/Os are connected simultaneously. Flip-chip interconnection is the connection of an integrated circuit chip to a carrier or substrate, which provides the shortest chip-to-packaging interconnection distance and has superiorities such as minimum resistance and minimum capacitance. Electrical performance and, consequently, the system reliability are highly dependent on the interconnection features. As a result, interconnection behaviour is a key issue in the long-term performance of a microsystem.
