Adhesion and Tribological Properties of Sputtered Polymer Thin Films from a Polyimide Target

Abstract Polymer thin films were sputtered from a polyimide, biphenyl dianhydride-p-phenylene diamine (BPDAPDA), target onto a copper substrate by conventional RF sputtering with argon (Ar) and nitrogen (N2). These polymer thin films (sputtered PI thin films with Ar and N2) were characterized, and their adhesion and tribological properties were evaluated.