ABSTRACT
ABSTRACT: At CIS, we develop a non-destructive and, ultimately, non-contact method to measure CVD and ALD layers. These layers are well established in the manufacturing processes of the semiconductor industry for example. We want to monitor the process and scan their thicknesses and relative permittivities. For this we use modified Interdigital structures with a few microns distance. CiS produces such structures for a long time-eg to produce humidity sensors.
