ABSTRACT
Mechanically flexible interconnect (MFI) is a flexible I/O technology developed at Georgia Tech that aims to provide MFI as much vertical range of motion as possible. By leveraging new advances in flexible I/O technologies and through-silicon vertical interconnect access technologies, one can create a generic integration platform for state-of-the-art complementary metal oxide semiconductor and arbitrary microelectromechanical systems devices. This chapter discusses the motivation and need for such interconnects as well as overview of challenges involved in design and fabrication of such interconnects. It describes process flow for fabrication of MFIs. The first part of the process is the fabrication of the curved polymer surface. This is done by spin coating a photo-definable sacrificial polymer and then reflowing it. The second part of the process is to deposit an electroplating seed layer on top of the reflowed polymer. The third part of the process is to spin coat and pattern an electroplating mould for the electroplating of the interconnect beam structure.
