ABSTRACT
This chapter presents a complete user tool for WaferBoard, a rapid reconfigurable electronic prototyping system and a methodology to evaluate and predict a steady-state thermo-mechanical behaviour of reconfigurable wafer-scale IC. Users configure their electronic systems by interacting with the WaferIC through accessing features offered by the WaferConnect software via its GUI. These features include procedures for hardware diagnosis, user IC package identification, routing and WaferIC configuration. The DreamWafer project proposes a new approach to the rapid prototyping of electronic systems with a wafer-scale prototyping platform called WaferBoard. WaferConnect software is developed to control the hardware platform, specifically the WaferIC. The software is designed to allow users to effectively control the hardware platform. The chapter also presents thermo-mechanical validation issues that have been resolved with steady-state thermo-mechanical analysis using a combined mechanical and thermal heat transfer approach for thermal and distortion behaviour analysis.
