ABSTRACT
2.5D interposer side-by-side assembly and three-dimensional (3D) stacking of functional integrated circuits (ICs) are identified as inevitable solutions for future system miniaturization and functional diversification. 2.5D/3D integration offers a long list of benefits in terms of system form factor, density scaling and multiplication, reduced interconnection latency and power consumption, bandwidth enhancement, and heterogeneous integration of disparate technologies. In 2.5D integration, ICs are placed side-by-side in close proximity on a suitable substrate such as silicon interposer. On the other hand in 3D implementation, thinned IC layers are seamlessly bonded with a reliable bonding medium and vertically interconnected with electrical through-strata-via (TSV). This chapter discusses the drivers and new integration capabilities brought about by 2.5D/3D technology, enabling technology platforms, and potential applications made possible by 2.5D/3D technology. A future outlook is provided at the end.
