ABSTRACT
Despite the numerous advantages of substantial silicon density in 3D VLSI, such as small form size, low power consumption, and high operating frequency, it introduces many serious challenges. The most alerting ones is the thermal threat, which would lead to various faults and system failures. This chapter introduces a new strategy to effectively diffuse heat from NoC-based 3D CMPs. A runtime dynamic programming network (DPN) is proposed to optimize routing directions and provide temperature moderation across the whole chip. Both on-chip reliability and computational performance have been improved by 63% and 27%, respectively, with the DPN approach. This work enables a new avenue to explore the adaptability for future large-scale 3D integration.
