ABSTRACT
The concept of 3D integrated circuits (3D-ICs) provides new opportunities for Meeting current and future design criteria, such as performance, functionality, delay, and power consumption. 3D-ICs are thus considered as a promising approach to spur both More Moore (i.e., further down-scaling of baseline CMOS device nodes) and More-than-Moore (i.e., diversification of functionality; heterogeneous system integration) [1,9] as shown in Figure 17.1. At the same time, 3D-ICs increase complexity for manufacturing and physical design notably. Besides the well-known trend for downscaling device nodes, slowly but surely reaching its limits for CMOS technology, the need for diversification has been acknowledged [<xref ref-type="bibr" rid="ref17_9">9</xref>]. The concept of 3D integrated circuits is considered a promising option to combine both avenues. https://s3-euw1-ap-pe-df-pch-content-public-p.s3.eu-west-1.amazonaws.com/9781315214306/963a4f3b-ca0a-40a0-956b-53cf3973ad6f/content/fig17_1.tif"/>
In the previous chapters, various 3D design and application approaches have been discussed in detail. In this final chapter of the book, we aim to revise key technological and design challenges, and to point out prospective directions for further adoption of 3D-ICs.
