ABSTRACT

Building on technology developments in the areas of continuous Si ribbon growth (String Ribbon) and polymeric materials for PV modules, a method is described for forming wraparound contacts on these wafers and then interconnecting the cells in a monolithic fashion. A significant reduction in processing steps and cost can then be realized, and thinner Si ribbon can be processed with higher yields. Modules with 84 cm2 and 120 cm2 String Ribbon wraparound cells and printed interconnect patterns were formed using this monolithic module procedure. Accelerated reliability testing of these modules is encouraging.