ABSTRACT
Wheat endosperm presents a complex granular structure with adhesion. The grinding behavior of endosperm is highly related to its vitreousness and its hardness. Mechanical tests on samples of endosperm proved that it was possible to predict the grinding, but, without highlighting the relative importance of the connections between particles. The originality of our work consists in using a model medium to control the bonding strengths between particles, and thus to propose relevant values for the numerical simulation of the fracture of the wheat endosperm. The simulation of the crack propagation is compared with the rupture in model material. The use of model material to understand the connections between the starch granules in the endosperm remains our objective.
