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      Chapter

      Guidelines for Temperature-Tolerant Design and use of Electronic Packages
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      Chapter

      Guidelines for Temperature-Tolerant Design and use of Electronic Packages

      DOI link for Guidelines for Temperature-Tolerant Design and use of Electronic Packages

      Guidelines for Temperature-Tolerant Design and use of Electronic Packages book

      Guidelines for Temperature-Tolerant Design and use of Electronic Packages

      DOI link for Guidelines for Temperature-Tolerant Design and use of Electronic Packages

      Guidelines for Temperature-Tolerant Design and use of Electronic Packages book

      ByPradeep Lall, Michael G. Pecht, Edward B. Hakim
      BookInfluence of Tempemture on Microelectronics and System Reliability

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      Edition 1st Edition
      First Published 1997
      Imprint CRC Press
      Pages 18
      eBook ISBN 9780138750879
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      ABSTRACT

      This chapter determines the thermal stress limits on electronic packages for safe operation which ensures a desired useful mission life. The mechanism of wire fatigue involves the flexure of the wire about the reduced wire cross-section at the heel during temperature cycling. The mechanism has a dominant dependence on the magnitude of the temperature cycle and is independent of steady-state temperature. The critical intermetallic layer thickness is calculated based on the intermetallic compounds that form the fastest for the bimetallic combination. A horizontal line on the graph at a thickness equal to the wire thickness at the bond pad gives the time-temperature product that will result in failure after time equal to the abscise. Reversion is a steady-state temperature-dependent phenomenon that actuates the reversion temperature for the encapsulant or molding compound.

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