ABSTRACT
The 'conventional wisdom' evolved over the last few decades dictates that the reliability characteristics of integrated circuit (IC) components can be described by the 'bathtub' curve. Best-in-class companies are consequently developing a set of new practices, based on the physics-of-failures, reliability statistics, and an understanding of interactions between the design and process attributes, in order to manage reliability throughout the IC product life cycle. The 'conventional methodology' for management of IC reliability dictates that component reliability is to be empirically demonstrated through accelerated life tests – i.e., tests at elevated temperature or voltage, extreme mechanical or thermal cycling. In fact, a set of 'standard' tests has evolved and defined in military specifications and standards. If a reliability issue is found during these tests, the circuit is redesigned or the manufacturing process is changed, and the product is tested again.
