ABSTRACT
Product quality and reliability are dependent upon the screens used to detect defects that are introduced during the manufacturing process. This chapter focuses on the specific tests used by manufacturers to screen out defective products. Specific problems associated with burn-in are discussed, along with the expense associated with performing burn-in. When performing burn-in, it is important that the screening duration and stress magnitudes be determined using engineering judgment. The burn-in data consist of the total number of parts burned-in along with the number of apparent failures detected via functional tests. IDDQ testing is capable of detecting inter-level shorts, multiple stuck-at-faults, pinholes, spot defects and soft defects. IDDQ can identify a wide range of failure types including those undetectable by stuck-at-fault testing. Such types include parasitic transistor leakage, gate-oxide defects, bridging defects, leaky p-n junction, and transistor faults. The chapter provides an alternative approach to the widespread philosophy of screening and screening elimination.
