ABSTRACT
Failure mechanisms in microelectronics devices are either categorized according to the type, or mode, of the failure precipitated, or according to the root cause, or mechanism. Failure mechanisms address the physical phenomena such as overstress, electromigration, and corrosion. Intrinsic failures are typically wearout type failure mechanisms. The distribution of the time-to-failure for the test structures then describes the capabilities of a given process's technology, and the reliability design rules are defined as a load condition that corresponds to a distribution or a point on a distribution that represents the desired intrinsic reliability. Extrinsic failures are dependent on both the defectivity associated with the semiconductor and packaging processes and the complexity of the design and manufacturing processes. Extrinsic failures are typically managed through the applications of "best" practices used to improve process quality and yield, and the failure rate is normally evaluated through product level accelerated life tests.
