ABSTRACT
Three-dimensional (3D) sensors were proposed by Sherwood Parker and collaborators in 1997. In 3D sensors, heavily doped trenches, having the same characteristics of the ohmic columnar electrodes and surrounding all the physical perimeter of the device, can be used to terminate both physically and electrically the active volume without dicing. Device simulation was a key in gaining a deep understanding of the behavior of 3D sensors before fabrication and tests of the first prototypes. Device simulations have proven very effective in predicting the resistance–capacitance product time constants of the electrodes to be in the order of 100-200 ps for 300 μm thick sensors. The 3D-double-sided double-type columns were designed as a comparable alternative to full 3D sensors with a reduced process complexity. In 3D sensors, signals are normally read out only from one electrode type, which is typically the junction electrode, with the other type being used for biasing purposes.
