ABSTRACT
The Three-Dimensional (3D) Sensor Collaboration was initially determined to perform accurate and systematic comparative tests of the available 3D samples from different processing facilities to speed up the transition between the previous fragmented test programs to a true industrialization. This chapter explains the principal milestones of the common design effort agreed to within the 3D A Toroidal LHC Apparatus Collaboration for the Insertable B-Layer (IBL) project. The IBL project provided the first real opportunity for 3D sensors to be considered for an experiment, followed by the production strategy, the 3D sensor specifications, and analysis of a few key selected results from the electrical characterization of the common production. The IBL production gave a significant boost to the development of 3D sensors. The chapter explains the selected results from the electrical characterization of qualification and production batches. I-V measurements were performed on each sensor on wafers using a probe station with a dedicated probe card and standard semiconductor test equipment.
