ABSTRACT

This chapter explores which novelties three-dimensional (3D) technology could bring with respect to traditional planar semiconductors and investigates its potential for different disciplines, such as future high-energy physics detectors and systems, medicine, and neutron detection. The configuration of 3D sensors with p+ and n+ electrodes, as well as active edges, penetrating the semiconductor's substrate either partially or fully, allows tailoring radiation sensors to fit special requirements in many fields. The performance of the Insertable B-Layer 3D and planar sensors has been monitored since their installation to control their degradation after irradiation. Beyond high-energy physics, high-speed detectors would be useful in medicine and biological applications where fast-changing events, such as protein folding, could be monitored as the result of a chemical reaction, or the imaging precision could be enhanced in time of flight positron emission tomography. Grayscale lithography is a specialized lithography process that results in 3D resist profiles.