ABSTRACT
It is shown how the approach based on the concept of interfacial compliance could be employed in accelerated testing of electronic and photonic assemblies and particularly in situations when the Boltzmann–Arrhenius–Zhurkov (BAZ) constitutive equation is used. The following topics are covered: accelerated testing types, the role and attributes of failure-oriented-accelerated-testing (FOAT), the multiparametric BAZ equation and its applications, temperature cycling and predicted time-to-failure (TTF), incentive for mechanical prestressing of accelerated test specimens, and incentive for using a low-temperature/random-vibrations bias for accelerated testing of solder joint interconnections.
