ABSTRACT
The first step toward the integration of a flexible electronic systems is the selection and fabrication of a suitable substrate. The materials used to fabricate substrates need to have specific electronic, mechanical, and thermal properties. The active materials used for device formation are then either grown or deposited on these substrates using various microfabrication techniques. In this chapter, we discuss the properties associated with ideal flexible substrates and the various material systems used so far as flexible substrates such as metal foils, glass, and polymer thin films. The “transfer printing” process which is used to transfer electronic devices from a destination substrate to a host, using various kinds of stamps, is also discussed.
