ABSTRACT
The world of flexible electronics draws from the traditional manufacturing techqniues used in silicon electronics industry, as well as the novel manufacturing techniques being developed in other industries. Printing electronic components directly on flexible substrates is one such novel integration strategy that is recently gaining traction. In this chapter, we discuss the development of printing techniques such as inkjet printing, spray coating, screen printing, etc., for the fabrication of electronic components on a flexible substrate, with a detailed investigation of the physics of ink formulation and droplet formation in inkjet printing. The novel world of 3D printing is discussed from the point of view of applications in flexible electronic systems, along with other emerging approaches such as nanoimprint lithography, and self-aligned imprint lithography.
