ABSTRACT
This chapter explains the concept of the integrated optical interconnects after advantages of lightwave implementation into boxes of computers are reviewed. The integrated optical interconnects simplify the lightwave-implemented computers and enable us to treat them just like the pure electronic computers, reducing the optics excess. For fabrication processes, in conventional optical interconnects, typically, packaging based on the flip-chip bonding, in which assembling with precise alignments of individual optoelectronic (OE) devices is necessary, is used. In 3D integrated optical interconnects, there are two issues, namely, an issue related to optical couplings and an issue related to construction of 3D optical wiring backbones. In 3D structures a large number of optical couplings between OE devices are involved.
