ABSTRACT
Solder and automated soldering processes are relevant topics for electronics manufacturing and test engineers. Historically, mechanical integrity was assured by wrapping connection wires two or three times around a soldering terminal post. The strength of a rosin flux is proportional to the ratio of rosin to solvent and to the amount of halide and/or nonhalide activators. A halide is formed when a very active nonmetallic chemical element such as bromine or chlorine is included as part of the chemical compound used in the flux. In applying flux before the soldering operation, the correct quantity must be used. Too little flux results in soldering process defects as oxides and tarnish are not removed and the surfaces are solderable. Lower solids content of fluxes makes them easier to remove during cleaning operations. Water-soluble organic and synthetics activated fluxes are stronger than the rosins.
