ABSTRACT
This chapter discusses various coating and encapsulating methods. Electronic components and assemblies are commonly coated and encapsulated to protect them from damage or degradation from environmental influences. When the discrete components are not to be covered but the substrate requires encapsulation, circuit board solder mask may be used effectively. Conformal coating provides the additional advantage of covering discrete components and solder joints as well as the substrate surface. Encapsulation is an alternative procedure to conformal coating where more space is allowed for the subassembly and more mechanical support is required. If this encapsulation method is to be used, there are certain other considerations that the manufacturing engineer will want to remember. One of the most common problems with encapsulation (or conformal coating) is the tendency of these materials to entrap air or other gases during the curing cycle.
