ABSTRACT
Hybrid assemblies are small and they tend to look alike when viewed at arm’s length by the unaided eye. Sometimes close scrutiny is required to differentiate between circuits having the same general design characteristics. These assemblies are more convenient for installation into printed circuit boards when they are in a SIP package configuration. If an insertion head is dedicated to a single hybrid assembly, the task is less difficult than when more than one assembly is handled by the tooling. The SIP lead configuration offers distinct advantages for packaging and assembly of hybrid circuits, but it also has the disadvantage of allowing the assembly to be easily moved out of position after assembly and before soldering. Repair and modification of hybrid assemblies sometimes calls for cutting of conductor traces and adding jumper wires.
