ABSTRACT
This chapter starts by reviewing the function of hybrid assemblies to reorient thinking in the direction of why hybrid assemblies exist in the arsenal of electronic designers. Hybrid assemblies and multichip modules fill a very important need in electronic equipment design that in no way could be satisfied by specialized electronic integrated circuit chips or printed circuit subassembly modules. The electronic circuit design is determined basically by the product requirements and by how the engineer has chosen to meet these requirements. Hybrid assemblies are traditionally mounted on thick-film substrates with a ceramic base material. Hybrid assemblies have used surface-mount technology for many years. In fact, these assemblies had been forced to use surface-mount techniques long before components were widely available for this purpose.
