ABSTRACT
This chapter considers the metallized conductor layers along with the insulating materials that will be required if more than one layer of conductors are to be used. The materials that are applied to the ceramic substrate to produce the thick-film circuit are: conductor inks, resistor inks, dielectric materials, and overglazes. Thick-film conductors are typically either silver or gold alloyed with platinum or palladium. These metals are usually mixed with glass frit or other materials to provide the desired characteristics for screening and firing to produce acceptable conductors. The materials used to deposit thick-film resistors on hybrid substrates are primarily metal bearing ceramics whose electrical resistivity is adjusted by varying the ratio of ceramic to metal. Final adjustment of the resistor value is made by abrasive trimming or laser trimming.
