ABSTRACT
Being the oldest surface-mount technology in the electronics world, hybrid assembly has waited a long time for component designs to catch up with its needs. Certain lead configurations, such as DIP, were easily converted to gull-wing or J lead geometries to adapt them for this use. Other package configurations, such as radial leaded components, axial leaded components, and transistors, were not so easily adapted. Footprint design is the layout of soldering pads for surface-mount components. The structure of the solder joint and the geometry of the component lead largely determine the size, shape, and position of these solder pads. When the component lead is off location with regard to the solder pad, the solder connection is adversely affected. The degree of these adverse effects is directly proportional to the amount of dislocation.
