ABSTRACT
Packaging is the stage and testing is the last stage of semiconductor device fabrication. Packaging is also known as encapsulation, because the term packaging generally comprises the steps or the technology of mounting and interconnecting of devices. In the semiconductor industry it is known as simply packaging and sometimes as semiconductor device assembly. Around 1980s pin numbers of Very Large-Scale Integration circuits exceeded the limit for Dual in-line Package. In the late 1995s, plastic quad flat pack and thin small-outline packages became the most common for high pin count devices. Flip-chip Ball Grid Array permitted higher pin count than other package types available that time.
