ABSTRACT
Modern diamond heat spreaders can be made by either the high-pressure method. Normally, diamond heat spreader must be metallized so that it can be brazed on a semiconductor chip or its substrate. As the price of diamond heat spreader will rise sharply with the enlargement of the size and the increase of the thickness, it may not be practical to use a diamond heat spreader with a thickness larger than 0.5 mm. In order to compromise the performance and the cost, the width of the diamond heat spreader should be about three times of the thickness. A novel diamond-copper heat spreader that can meet all the following requirements has been designed: high thermal conductivity, high electrical conductivity, tunable thermal expansion coefficient, metallized brazing contact. However, computer CPU is much larger, so it will require a larger diamond heat spreader.
