ABSTRACT
Digital printed circuit boards (PCBs) are made of dielectric and conducting layers laminated together into a stackup. Hardware designers have to keep very close attention to the materials and processes that go into the digital board's stackup because that determines signal integrity performance through trace impedance, insertion loss, via impedance, crosstalk, mode conversion, Fiber Weave Effect skew, and other things. It is important for us to accurately characterize these materials for SI simulations as well as for design and manufacturing documentation.
