ABSTRACT
Since introduction in the early 1960s a large selection of adhesives became available for hybrid applications. Nonconductive and conductive adhesives are used in power hybrids to provide mechanical bond and electrical contact. Conductive adhesive is used primarily to attach low power semiconductor devices, integrated circuits, thin-film resistors with backside contact, and capacitors. Nonconductive adhesive is used to provide mechanical bond when electrical contact is not required. It is used to mount ceramic substrate in the case and attach passive components, such as inductors, ferrite cores, thick-film resistors, and optocouplers to the substrate. It is also used to reinforce large ceramic and tantalum capacitors, which require electrical contact but need additional bonding to the substrate. Implementation of Mil-Std-883C, Method 5011 established a new standard for adhesives used in high reliability military and space applications.
