ABSTRACT
The assembly drawing is used to identify the exact position and placement of components and wire-bonds with reference to conductor/resistor pattern and package leads. The drawing may include detail views of alternate chip assembly and standard notes with reference to processing documents. A separate drawing is created when it becomes necessary to provide details of an individual subassembly. In addition to details of each subassembly, the composite assembly drawing shows interconnections between substrates and substrates with package leads. All I/Os are numbered and labeled per schematic drawing.
