ABSTRACT
ADHESION: The property of one material to remain attached to another; a measure of the bonding strength of the interface between film deposit and the surface which receives the deposit; the surface receiving the deposit may be another film or substrate. ADHESIVE: A substance used for firm attachment by exerting force of attraction between molecules of mating surfaces in an adhesive bond. In hybrid assembly, adhesives are basically organic polymer compounds, such as epoxies, together with their additives. When hardened after curing, adhesives will bond substrates to packages, or dice and chip carriers to substrate lands, etc. ALLOY: A combination of two or more metallic elements in the form of a solid solution of one or more metals in another metal, or distinct phases, or components, of an alloy. ALUMINA: Aluminum oxide (AI2O3), a ceramic material often used for substrates or in ceramic bottom construction packages. Most alumina substrates contain 90-99% aluminum oxide. ALUMINUM NITRIDE: A ceramic material with high thermal conductivity and high electrical resistivity. Used in applications to high power hybrids, and modules, and when high thermal conductivity is required. AMBIENT TEMPERATURE: Temperature of atmosphere in intimate contact with the electrical part or device. AMPHOTERIC: Literally, partly one, and partly the other. Specifically, capable of reacting either as an acid or as a base. Amphoteric metallic coating materials may be applied to the backside of silicon VLSI wafers to promote ad-
