ABSTRACT
An organic polymer epoxy adhesive having metallic particles such as gold, silver, palladium, etc. included as fillers in its formulation. ELECTRICALLY HOT CASE: A hybrid circuit package that is used as part of the grounding circuit. ELECTRODES: The conductor or con-
ductor lands of a hybrid circuit. Also the metallic portions of a capacitor structure. ELECTROLESS PLATING: Deposit of a metallic material on a surface by chemical deposition as opposed to the use of an electric current. ELECTRON BEAM BONDING: Bonding two conductors by means of heating with a stream of electrons in a vacuum ELECTRON-BEAM PATTERNING: E-
beam, or EB, patterning of resist produces the required thin lines (as in VLSI) by evaporation from the heat supplied by the energy of a narrowly focused electron beam. ELECTRONIC PACKAGING: The technical discipline of designing a protective enclosure for an electronic circuit so that it will both survive and perform under a plurality of environmental conditions. ELECTROPLATING: Deposition of an adherent metallic coating onto a conductive object placed into an electrolytic bath composed of a solution of the salt of the metal to be plated. Using the immersed object as the cathode and the other terminal as the anode (possibly of the same metal as the one used for plating), a DC current is passed through the solution affecting transfer of metals ions onto the cathodic surface. ELECTROSTATIC DISCHARGE: ESD
is the instantaneous transfer of charges accumulated on a nonconductor, along a conductor into ground; caused either by direct contact or induced by an electrostatic field. If an ESDS (an ESD-Sensitive
item such as a MOS die) happens to be in the discharge path, it may suffer obvious destruction or latent damage, even if the ESD event was too weak to be felt. ELEMENT: A constituent unit which contributes to the operation of a hybrid microcircuit. Integral elements include deposited or screened passive circuit elements, metallization paths, and deposited or formed insulation. Discrete or integrated electronic parts including dice, chips, and other microcomponents; also mechanical piece parts as cases, covers, and certain wires, all contibuting to the operation of a hybrid microcircuit. ELONGATION: The ratio of the increase in wire length at rupture, in a tensile test, to the initial length, given in percent. EMBEDDED: Enclosed in plastic material. EMITTER ELECTRODE: The mettalic pad making ohmic contact to the emitter area of a transistor element. EMULSION: The light-sensitive material used to coat the mesh of a screen. ENCAPSULATION: The process of completely enclosing an article in an envelope of dielectric material. ENTRAPPED MATERIAL: Gas or particles (inclusions) bound up in a solid or in an electrical package. ENVIRONMENT: The physical conditions, including climate, mechanical, and electrical conditions, to which a product may be exposed during manufacture, storage, or operation. ENVIRONMENTAL TEST: A test or series of tests used to determine the sum of external influences affecting the
structural, mechanical, and functional integrity of any given package or assembly. EPOXY ADHESIVE: An organic polymer compound consisting of a thermosetting resin, a filler, a binder, a hardening agent, with a catalyst added, together with minor additives. The resin is one in which an oxigen atom is joined to each of the two other connected atoms. Epoxy is commonly used in paste form for bonding in hybrid assembly; it subsequently undergoes a curing cycle (polymerization) for hardening. ETCHBACK: Process for removing controlled amounts of dielectric material from hole sidewalls. ETCHED METAL MASK: A metal mask used for screening where-in the pattern is created in a sheet of metal by the etching process. ETCH FACTOR: Ratio of etch depth to lateral etch in a conductor pattern. ETCHING: The chemical, or chemical and electrolytic, removal of selected conductive material to form a conductive pattern.
