ABSTRACT
LEAD: A conductive path which is usually self-supporting. LEAD EXTENSION: The portion of the component lead or wire protruding beyond the solder joint or package body. LEADS, FLAT PACKAGE: Normally
are round or rectangular in cross-section, protruding on one or all sides of flat package (flatpack). Leads in power package are made from materials with high electrical conductivity. To be differentiated from pins in plug-in package. LEAD FRAMES: The metallic portion of the device package that completes the electrical connection path from the die or dice and from ancillary hybrid circuit elements to the outside world. LEAD PROJECTION: The distance that a lead protrudes beyond the surface of the printed board.
