ABSTRACT
Radio frequency microelectromechanical systems (RF MEMS) device packaging at the wafer level is one of the critical areas for its application, as the MEMS elements are delicate and can easily get damaged during wafer scribing or the packaging process. Hermetic or near-hermetic packaging ensures the best case stability performance in MEMS devices without being affected by moisture. The 0-level packaging demonstrates few advantages to a MEMS device, including low-cost fabrication process with physical protection, low loss or less RF signal feed through, and hermetic-preventing moisture. The thin-film encapsulation demonstrates much low-profile wafer-level integrated-circuit compatibility. Readers may note that many well-established technologies are also available and widely implemented for die bonding for MEMS packaging, including solder bonding, gold–gold thermocompression bonding, low temperature glass frit or seals. The use of low temperature cofired ceramic packaging and integrated module development was briefly discussed. Interested readers may get more information on RF MEMS packaging from the given references.
