ABSTRACT
As the capabilities of MEMS become more widely recognized, it is also recognized, however, that the biggest obstacle to growth of MEMS applications is the design cycle time, because it depends on tightly coordinated application of advanced design, analysis, manufacturing, and testing tools. Effective development of MEMS requires the synergism of advanced computer-aided design (CAD), computer-aided engineering (CAE), computer-aided manufacturing (CAM) and fabrication methodologies, materials science and technologies, and also of effective quantitative testing methodologies for characterizing their performance, reliability, and integrity [6-8]. Testing of MEMS includes measurements of their electrical, optical, and mechanical responses to the driving signals and environmental loading conditions. Furthermore, in order to understand the mechanics of MEMS
and the materials used for their fabrication, advanced noninvasive testing methodologies, capable of measuring the shape and changes in states of deformation of MEMS packages and materials subjected to actual operating conditions, are required [6-8,15-19].
