ABSTRACT
Spectroscopic techniques such as x-ray photoelectron spectroscopy (XPS), spectroscopic ellipsometry (SE), dual-beam spectroscopy (DBS), high-resolution electron energy loss spectroscopy (HREEL), Auger electron spectroscopy (AES), Raman spectroscopy (RS), and Brillouin scattering (BS) have found several applications in the microelectronics world. Most of these techniques are used for materials analysis, some for film thickness measurements, others for mechanical analysis.
