ABSTRACT
Not only is there a requirement for testing electrical and dynamic behavior of MEMS, but there is also considerable demand for methods to test these systems during both the development phase and the entire manufacturing phase. With the aid of these test methods, it is possible to assess such static properties as the dimension, shape, presence, orientation, and surface characteristics of microsystems and their components. Using an optical measurement and testing technique based on image processing and computer vision, a wide range of procedures that enable such properties to be recorded rapidly and in a robust and noncontact way can be applied.
