ABSTRACT
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Microelectromechanical systems (MEMS) devices used in space missions are
exposed to many different types of environments. These environments include
manufacturing, assembly, and test and qualification at the part, board, and assembly
levels. Subsystem and system level environments include prelaunch, launch, and
mission. Each of these environments contributes unique stress factors. An overview
of these stress factors is given along with a discussion of the environments.
