ABSTRACT
The sputtering rate does not change much with the increase of cathode surface area at low system pressure ( p¼ 10mtorr). The plasma treatment is localized and effectively confined. However, at a relatively high system pressure ( p¼ 50mtorr), the sputtering rate is almost zero for the larger cathode. This case reiterates the importance of system pressure in AMT Ar sputtering treatment.
