ABSTRACT
This chapter examines the deposition by evaporative condensation and sputtering of thin films, the thickness of which may range from approximately ten nanometers to several tens of microns. These plasma-related deposition technologies are essential to several major industries, as well as a wide range of niche applications. The chapter discusses thin films deposition by the purely physical evaporation or sputtering processes. The industrial sputtering of thin films is done under vacuum at pressures low enough that sputtered atoms are transported directly from the target to the workpiece with few or no collisions. Plasma-related sputtering and evaporative condensation technologies are used to deposit thin films for microelectronic circuit fabrication, optical coatings, recording media, ornamental brightwork, protective coatings, and many other applications. Plasma-deposited thin films with the appropriate characteristics can reflect incident infrared radiation, thus reducing heat loads in warm climates, and saving air-conditioning expense.
