ABSTRACT
In the microelectronic industry, plasma sources that operate under vacuum, at low pressures with long ion mean free paths are preferred to higher pressure sources in order to enhance directional etching. The plasma sources used in industry are described by their manufacturers and users in terms of a small set of characteristics that define their regime of operation. The physical fundamentals of plasmas and the physical processes occurring in direct current and radiofrequency (RF) plasma sources of most relevance to industrial applications. Plasma surface treatment involves using direct plasma exposure to change the surface energy, wettability, wickability, and bonding of fabrics, films, and solids, and the sterilization, cleaning, and decontamination of surfaces. The plasma jet is normally in frozen-flow chemical equilibrium as it transits the distance from the nozzle to the workpiece. The plasma torch may pose significant safety and regulatory issues related to potential RF interference from its power supply.
